Synthesis of Silica Coated Silicon Substrate by Recycling Silicon Sludge Generated in Semiconductor Packaging Process and Their Application to Epoxy Molding Compound

In this study, silicon sludge from a semiconductor packaging process is recycled to fabricate silica coated
silicon-sludge and applied as a filler for an epoxy molding compound(EMC). Silicon-sludge powder(S-sludge) is treated with acid to remove metallic impurities and then coated using the sol-gel method to synthesize silica coated silicon-sludge powder(SS-sludge).

The as-synthesized SS-sludge is subsequently mixed with epoxy resin, a curing agent, and carbon black to create an EMC(SS-sludge EMC). The heat dissipation properties of the EMC were examined using an IR camera. IR camera analysis confirmed that the SS-sludge EMC exhibited the highest surface temperature of 58.5°C compared to SiO2-based EMC. This enhancement in heat dissipation using SS-sludge EMC is attributed to the excellent thermal conductivity(150W/mK) of the silicon substrate and the presence of the silica layer on the SS-sludge surface which effectively enhances the thermal property of the EMC.

Therefore, this study successfully demonstrates the recycling of silicon sludge from a semiconductor packaging process by synthesizing silica coated silicon-sludge and suggests a novel application of this material in semiconductor packaging.

Project Date:

• 20.09.2024

Link:

• https://koreascience.kr/article/JAKO202430443310465.page